JPH0212180B2 - - Google Patents

Info

Publication number
JPH0212180B2
JPH0212180B2 JP57007130A JP713082A JPH0212180B2 JP H0212180 B2 JPH0212180 B2 JP H0212180B2 JP 57007130 A JP57007130 A JP 57007130A JP 713082 A JP713082 A JP 713082A JP H0212180 B2 JPH0212180 B2 JP H0212180B2
Authority
JP
Japan
Prior art keywords
epoxy resin
copper
experimental example
prepreg
brominated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57007130A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58124643A (ja
Inventor
Yoshitomo Tsutsumi
Shigeyoshi Nakamura
Hiroshi Fukukawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Chemical Products Co Ltd
Original Assignee
Toshiba Chemical Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Products Co Ltd filed Critical Toshiba Chemical Products Co Ltd
Priority to JP713082A priority Critical patent/JPS58124643A/ja
Publication of JPS58124643A publication Critical patent/JPS58124643A/ja
Publication of JPH0212180B2 publication Critical patent/JPH0212180B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Laminated Bodies (AREA)
JP713082A 1982-01-20 1982-01-20 銅張積層板 Granted JPS58124643A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP713082A JPS58124643A (ja) 1982-01-20 1982-01-20 銅張積層板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP713082A JPS58124643A (ja) 1982-01-20 1982-01-20 銅張積層板

Publications (2)

Publication Number Publication Date
JPS58124643A JPS58124643A (ja) 1983-07-25
JPH0212180B2 true JPH0212180B2 (en]) 1990-03-19

Family

ID=11657491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP713082A Granted JPS58124643A (ja) 1982-01-20 1982-01-20 銅張積層板

Country Status (1)

Country Link
JP (1) JPS58124643A (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6262747A (ja) * 1985-09-14 1987-03-19 松下電工株式会社 積層板
JPS62167044A (ja) * 1986-01-20 1987-07-23 東芝ケミカル株式会社 銅張積層板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5145636A (ja) * 1974-10-17 1976-04-19 Nippon Steel Corp Shoseigatasenkoyosetsuyofuratsukusu oyobi sonoseizohoho

Also Published As

Publication number Publication date
JPS58124643A (ja) 1983-07-25

Similar Documents

Publication Publication Date Title
WO2006109744A1 (ja) エポキシ樹脂組成物
JP2002003711A (ja) 熱可塑性ポリヒドロキシポリエーテル樹脂を含有する硬化性樹脂組成物
US5405931A (en) Epoxy resin compositions for use in electrical laminates
JP2003119253A (ja) エポキシ樹脂組成物
JP3809273B2 (ja) エポキシ樹脂組成物
JP2000219799A (ja) 難燃性エポキシ樹脂組成物および積層板
JPH0113422B2 (en])
JPH0212180B2 (en])
CN102838842A (zh) 环氧树脂组合物以及使用其制作的半固化片与覆铜箔层压板
US6265469B1 (en) Epoxy resin adhesive for flexible printed circuits
JPH0959346A (ja) 積層板用エポキシ樹脂組成物
JPH09143247A (ja) 積層板用樹脂組成物、プリプレグ及び積層板
EP0394965A2 (en) Resin composition for laminate
JP2833433B2 (ja) 積層板用エポキシ樹脂組成物および積層板の製造法
JP3226515B2 (ja) エポキシ基を含む含燐化合物の樹脂組成物およびその用途
JP2001011157A (ja) エポキシ樹脂組成物及び電気積層板
US5661223A (en) Composition of phenolic resin-modified epoxy resin and straight chain polymer
JP4567132B2 (ja) エポキシ樹脂組成物
JP3010534B2 (ja) エポキシ樹脂組成物
JP3009947B2 (ja) エポキシ樹脂組成物
JP3218436B2 (ja) エポキシ樹脂組成物
US5364925A (en) Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates
JP3159390B2 (ja) 積層板の製造方法
JP3440365B2 (ja) 積層板用エポキシ樹脂組成物
JP2002047334A (ja) エポキシ樹脂組成物及び電気積層板